New paper in Materials Letters - Cu doping of MnCo spinel

Our new paper has been accepted to Materials Letters: "Co-deposition of CuO and Mn1.5Co1.5O4 powders on Crofer 22 APU by electrophoretic deposition: structural, compositional modifications and corrosion properties" (LINK). What I think is very nice is the co-doping strategy to fabricate a mixed Mn,Co,Cu spinel. Co-doping is achieved by a simple co-deposition by electrophoretic method. Commercially available powders might be used and depending on the required thermal expansion doped by Cu and possibly other cations. It is a nice internationally collaborative paper, with POLITO, DTU and AGH inputs.
We should follow up with a full paper, focusing on high temperature corrosion properties of coated alloys within the next few months.